Epoxy Molding Compound
Full range of black epoxy molding compounds for encapsulation of various semiconductor IC packages. White epoxy molding compound for encapsulation of photocouplers and optocouplers.

Epoxy Die Attach Paste
Silver-filled epoxy paste for attaching semiconductor IC chips onto leadframes.

ACP & NCP
ACP (Anisotropic Conductive Paste) and NCP (Non-conductive Paste) for flip chip on FPC (Flexible Printed Circuit), rigid printed
circuit board and glass epoxy board applications.

Epoxy Liquid & Resin
High purity Glob Top material for COB (Chip On Board) and TAB (Tape Automated Bonding) applications, high purity underfill material for flip chips, high purity chip coating material for tape carrier packages, etc.

Epoxy Coating Powder
Overcoating of hybrid ICs, thermistors, varistors, resistor networks and film capacitors, etc.

Epoxy Potting Liquid
Potting for fly-back transformers, ignition coils, power modules, diodes, IC regulators, solid-state relays and insulation resin for LED display, etc.